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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Multistable, Bistable, Compliant Mechanisms, Stability, Multistable Compliant Mechanisms, Imperfections, Mechanical Engineering, Engineering, Mechanical Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Posture Prediction Model, Biomechanics, Standing Hand Force Exertions, Push Pull, Industrial and Operations Engineering, Engineering, Industrial & Operations Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Fiber Laser, EUV Lithography, High Power Pulsed Laser, Laser Produced Plasma, Electrical Engineering, Engineering, Electrical Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Quality Assurance for Multistatge Manufacturing Processes, State Space Model, Quality Planning, Process Diagnosis, Industrial and Operations Engineering, Mechanical Engineering, Engineering, Mechanical Engineering and Industrial and Operations Engin]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Carbon Dioxide Based Metalworking Fluids: an Environmentally Preferable and High Performance Alternative to Conventional Water-based Emulsions, Civil and Environmental Engineering, Engineering, Environmental Engineering and Natural Resources and Enviro]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Seakeeping, Multihull, Multihull Interactions, Blended Method, Naval Architecture and Marine Engineering, Engineering, Naval Architecture & Marine Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Walking, Arc Feet, Hodograph, Metabolic Cost, Energetics, Amputee, Engineering, Health Sciences, Mechanical Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Coarse Graining, Bead-spring Model, Bead-rod Model, Rouse Model, Bending Potential, Torsional Potential, Chemical Engineering, Engineering, Chemical Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[Cadmium Selenide, Quantum Dot, Hydrothermal Synthesis, High-temperature Water, Nanocrystal, Chemical Engineering, Engineering, Chemical Engineering]
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颁布单位:[University of Michigan] |
颁布时间:2008 |
实施时间:2008 |
学科分类:[MEMS Vacuum Packaging, Transient Liquid Phase Solder Wafer Bonding, Solder Wafer Bonding, Transferred Thin-Film Packaging, Solder Transfer, Electrical Engineering, Engineering, Electrical Engineering]