Near-Field Heat Transfer Enabled Nanothermomechanical Memory and Logic Devices

[摘要] A thermomechanical memory/logic device is disclosed. In embodiments, the thermomechanical device includes a first thermally controlled terminal (e.g., hot terminal); a second thermally controlled terminal (e.g., cool terminal/base); a stem or other structure that can be thermally expanded connected to the cool terminal; and a thermal conductive head coupled to the stem. The head can exchange heat with the hot terminal. The stem and head are between the first thermally controlled terminal and the second thermally controlled terminal, wherein the stem expands or contracts in response to heat absorbed or given off by the thermal conductive head, causing the head to move towards the first thermally controlled terminal or towards the second thermally controlled terminal until a stable state is reached. For example, bistable thermal states can be used to implement logic states (e.g., ZERO or ONE states).

[发布日期] 2018-07-10

[学科分类] 机械工程学

[关键词] THERMODYNAMICS;NEAR FIELDS;HEAT TRANSFER;SHAPE MEMORY ALLOYS;PATENTS