Economic performance of modularized hot-aisle contained datacenter PODs utilizing horizontal airflow cooling

[摘要] Evolutionary and revolutionary advances in computational and storage systems have driven electronic circuit densities to unprecedented levels. These high-density systems must be adequately cooled for proper operation and long life expectancy. Cooling solutions must be designed and operated to minimize energy and environmental impacts. Executive decisions are deeply rooted in the technical aspects of the systems and solutions sought. These interdependent solutions seek to maximize system performance while minimizing capital and operating expenditures over the economic life of the data center. Traditional data centers employ a raised floor plenum structure to deliver cooling via perforated floor tiles as the primary delivery system for component cooling. Heated exhaust air exits the equipment and travels upward to warm return plenum structures for subsequent capture and re-cooling. This floor-to-ceiling airflow behavior represents a vertical airflow-cooling paradigm. The resulting airflow may travel 150 feet or more per cooling cycle. A new class of data center cooling utilizes a technique called ;;in-row;; cooling. This new technique does not require a raised floor plenum, perforated tiles, nor return plenum structures. The airflow travels horizontally from rack-to-rack with respect to cold air delivery and warm air return. Airflow travel is subsequently reduced to only 10 feet per cooling cycle. This thesis will explore the economic benefits and economies of this new airflow paradigm against traditional data centers through the use of measurement and Computational Fluid Dynamic (CFD) modeling software.

[发布机构] Massachusetts Institute of Technology