CH Packaging Operations Manual
[摘要] Introduction - This procedure provides instructions for assembling the following CH packaging payload: - Drum payload assembly - Standard Waste Box (SWB) assembly - Ten-Drum Overpack (TDOP).
[发布日期] 2002-03-04 [发布机构] Waste Isolation Pilot Plant (N.M.)
[效力级别] [学科分类]
[关键词] Tdop;Trupact-Ii;Sarp;Assembly;Installation [时效性]