EUTECTIC BONDING OF A TI SPUTTER COATED CARBON AEROGEL WAFER TO AN NI FOIL

[摘要] The formation of high density, energy storage devices is achievable using composite material systems. Alternate layering of carbon aerogel wafers and Ni foils with microporous separators is a prospective composite for capacitor applications. An inherent problem exists concerning the formation of a physical bond between the Ni foil and the porous carbon wafer. The bond process temperature must be less than 1050 degrees C, at which point the aerogel begins to degrade. The advantage of a low temperature eutectic in the Ni-Ti alloy system solves this problem. Ti, a carbide former, is readily adherent as a sputter deposited thin film on the carbon wafer. A vacuum bonding process is then used to join the Ni foil and Ti coating through eutectic phase formation. The parameters for successful bonding are examined along with structural characterization of the Ni foil-carbon aerogel wafer interface. A 950 degrees C 30 min heat treatment under high vacuum is found to yield bond failure in the aerogel wafer covering one-third the surface area.

[发布日期] 1994-12-01

[效力级别]  Proceedings Paper