III-V/Si photonics by die to wafer bonding

[摘要] Photonic integrated circuits offer the potential of realizing low-cost, compact optical functions. Silicon-on-insulator SDI is a promising material platform for this photonic integration, as one can rely on the massive electronics processing infrastructure to process the optical components. However, the integration of a Si laser is hampered by its indirect bandgap. Here, we present the integration of a direct bandgap III-V epitaxial layer on top of the SOI waveguide layer by means of a die-to-wafer bonding process in order to realize near-infrared laser emission on and coupled to SOI.

[发布日期] 2007-07-01