Creep performance of transient liquid phase bonded haynes 230 alloy

[摘要] Creep performance of a potential heat exchanger alloy, Haynes 230 was investigated. To simulate mechanical performance of a heat exchanger, sheet material of Haynes 230 transient liquid phase (UP) bonded together. Sheets were plated on both sides with a Ni-P compound, subsequently stacked and TLP bonded together. Duplicate creep tests show low scatter in creep results, meaning a good repeatable joint was formed by Tip bonding. Overall creep performance showed less ductility and shorter times to failure than specimens originating from plate material. Evolution of a phosphorous compound at the bond line was observed and thought to potentially reduce ductility of the TLP bonded alloy.

[发布日期] 2019-12-19

[关键词] Characterization;Electron microscopy;Fracture mechanics/fracture behavior/fatigue;Stress/strain measurements;Nickel alloys;Grains and interfaces