Si-based system-in-package design with broadband interconnection for E-band applications

[摘要] This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radio-frequency (RF) interconnection from carrier board to the die is carefully designed based on the impedance transformation characteristic of the transmission line (TL). In addition, the simulation results show that the designed interconnection is robust to moderate process deviations. To verify the electrical performance of the designed interconnection, a dummy testing structure is designed, fabricated and measured. The measurement results show that the return loss is less than -10.6 dB in the commercial communication frequency range of 71-86 GHz for E-band applications.

[学科分类] 电子、光学、磁材料

[关键词] system-in-package ,silicon interposer ,E-band ,RF interconnection ,impedance matching