Design of a Ka-band receiver front end using Si-based system in package

[摘要] This letter presents a Ka-band receiver front end in the form of system in package using silicon substrate. The front end adopts a dual-channel superheterodyne structure, two GaAs downconverter chips and a power divider chip are integrated on the silicon substrate with an embedded substrate integrated waveguide bandpass filter. Wire-bonding is used for connections and unique impedance matching structure is designed and embedded into the GSG transmission line to compensate for additional insertion loss. The test results show a conversion gain of -13 . 4 dB without the gain of low noise amplifier. The work in this letter is one of few presentation of a RF system in the form of stacked silicon system in package, revealing the feasibility of stacked silicon in complex RF system implement.

[学科分类] 电子、光学、磁材料

[关键词] impedance compensation ,receiver ,RF front end ,stacked silicon ,system-in-package