Impact of ground solder ball failure in BGA package on near electric field radiation

[摘要] In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

[学科分类] 电子、光学、磁材料

[关键词] BGA package;near electric field radiation;connection failure