TSV-based SIW bandpass filter for W-band mobile communication applications

[摘要] The three-dimensional integration technology based on TSV can greatly improve the miniaturization of passive components. In this paper, a three-dimensional substrate integrated waveguide (SIW) filter suitable for 105GHz-110GHz is proposed. By using the coupling matrix synthesis method, a SIW filter is proposed with good high frequency performance and small volume. The results show that, the center frequency is 107GHz, the insertion loss is less than 1.5dB, the return loss is more than 20dB, and its physical size is only 0.7028×1.2428mm2.

[学科分类] 电子、光学、磁材料

[关键词] SIW bandpass filter;through-silicon via (TSV);coupling matrix synthesis method