Woven TPS - A New Approach to TPS Design and Manufacturing

[摘要] NASA's Office of the Chief Technologist (OCT) Game Changing Division recently funded an effort to advance a Woven TPS (WTPS) concept. WTPS is a new approach to producing TPS materials that uses precisely engineered 3D weaving techniques to customize material characteristics needed to meet specific missions requirements for protecting space vehicles from the intense heating generated during atmospheric entry. Using WTPS, sustainable, scalable, mission-optimized TPS solutions can be achieved with relatively low life cycle costs compared with the high costs and long development schedules currently associated with material development and certification. WTPS leverages the mature state-of-the-art weaving technology that has evolved from the textile industry to design TPS materials with tailorable performance by varying material composition and properties via the controlled placement of fibers within a woven structure. The resulting material can be designed to perform optimally for a wide range of entry conditions encompassing NASAs current and future mission needs. WTPS enables these optimized TPS designs to be translated precisely into mission-specific, manufactured materials that can substantially increase the efficiency, utility, and robustness of heat shield materials compared to the current state-of-the-art material options. By delivering improved heat shield performance and affordability, this technology will impact all future exploration missions, from the robotic in-situ science missions to Mars, Venus and Saturn to the next generation of human missions. WTPS can change the way NASA develops, certifies, and integrates TPS into mission life cycles - instead of being a mission constraint, TPS will become a mission enabler. It is anticipated that WTPS will have direct impact on SMD, HEOMD and OCT and will be of interest for DoD and COTS applications. This presentation will overview the WTPS concept and present some results from initial testing completed.

[发布日期] 2012-06-24

[学科分类] 材料科学（综合）