NASA-DoD Lead-Free Electronics Project

[摘要] The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

[发布日期] 2009-10-05

[学科分类] 电子与电气工程