NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

[摘要] This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention(JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to testthe reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort wouldcontinue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free ElectronicsProject while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.TheNASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur invarious board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occurduring assembly, rework, and post assembly handling and testing.

[发布日期] 2014-04-14

[学科分类] 电子与电气工程