High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

[摘要] Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

[发布日期] 2015-09-15

[学科分类] 电子与电气工程