Low-Melt Poly(Amic Acids) and Polyimides and Their Uses

[摘要] Provided are low-melt polyimides and poly(amic acids) (PAAs) for use as adhesives, and methods of using the materials for attaching two substrates. The methods typically form an adhesive bond that is hermetically sealed to both substrates. Additionally, the method typically forms a cross-linked bonding material that is flexible.

[发布日期] 2016-06-14

[学科分类] 电子与电气工程