Deep Trek High Temperature Electronics Project

[摘要] This report summarizes technical progress achieved during the cooperative research agreement between Honeywell and U.S. Department of Energy to develop high-temperature electronics. Objects of this development included Silicon-on-Insulator (SOI) wafer process development for high temperature, supporting design tools and libraries, and high temperature integrated circuit component development including FPGA, EEPROM, high-resolution A-to-D converter, and a precision amplifier.

[发布日期] 2007-07-31

[学科分类] 工程和技术（综合）

[关键词] DESIGN;INTEGRATED CIRCUITS;HEAT RESISTANT MATERIALS