The Sandia MEMS passive shock sensor : FY07 maturation activities.

[摘要] This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

[发布日期] 2008-08-01

[学科分类] 工程和技术（综合）

[关键词] MICROELECTRONIC CIRCUITS;SENSORS;DESIGN;PACKAGING;SIMULATION;TESTING;SHOCK WAVES;DETECTION Sensors.;Microelectromechanical systems.