Investigation into the mechanical performance of pipe grade HDPE with included silicon chips as a basis for future sensors

[摘要] A possible way to continuously monitor the whole water distribution system is to equip pipes with many microsensors.If these sensors are to be integrated within the pipe walls, it is important to assess their impact on the structural integrity of the pipes. In order to test a large number of samples, small polyethylene samples were produced using compression moulding and tested in different stress modes such as tension, bending, Charpy impact and flexural creep, with respect to different chip sizes (4 and 16mm\(^²\)), shapes (circle and square), numbers (one and two), orientations and position as well as sample dimensions and chip-polyethylene interface.It was discovered that the square chip contributes to the highest increase in the polymer stiffness, but significantly reduces its ductility. The 4mm\(^²\) circle causes the smallest disruption in the polymer integrity, especially when including multiple chips and when there is no adhesion. It significantly improves the impact resistance, while its effect in the short and long term bending stress modes is insignificant. The 16mm\(^²\) circle perpendicular to the load direction failed in bending at large strains. The optimal chip orientation for improving the impact strength and reducing the embrittlement effect in tension is parallel to the applied load.

[发布机构] University:University of Birmingham;Department:School of Engineering, Department of Civil Engineering

[关键词] T Technology;TA Engineering (General). Civil engineering (General)