Numerical Simulation of Bosch Processing for Deep Silicon Plasma Etching

[摘要] We present a simulation of the Bosch process using the feature-scale modeling software FPS3D. FPS3D is a generic simulator that can be applied to any set of materials, plasmas, reactive gases, and reactions for both 2D and 3D simulations of etching and deposition. FPS3D can simulate multi-time-step processes for which the fluxes, species, reactions, ion energies, angular distributions, and other parameters can change with each time-step; it is thus well-suited for Bosch process simulations. The polymer deposition and etching time-steps of the Bosch process are modeled and discussed in more detail than was previously attainable.

[发布机构] Technology Development Center, Tokyo Electron U.S. Holdings Inc, Billerica; MA; 01821, United States^1;Department of Computer Science, University of Pennsylvania, Philadelphia; PA; 19104, United States^2