Anand constitutive model of lead-free solder joints in 3D IC device

[摘要] Anand constitutive relation of SnAgCu and SnAgCu-nano Al solders were studied under uniaxial tension, and the constitutive model was used in the finite element simulation to analyze the stress-strain response of lead-free solder joints in 3D IC devices. The results showed that the nine parameters of the Anand model can be determined from separated constitutive relations and experimental results. Based on Anand model, the finite element method was selected to calculate the stress-strain response of lead-free solder joints, it was found that in the 3D IC device the maximum stress-strain concentrated in the concern solder joints, the stress-strain of SnAgCu-nano Al solder joints was lower than that of SnAgCu solder joints, which represented that the addition of nano Al particles can enhance the reliability of lead-free solder joints in 3D IC devices.

[发布机构] School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou; 221116, China^1;Institute of Metal Research, Chinese Academy of Sciences, Shenyang; 110016, China^2;School of Information and Art, Jiangsu Vocational Institute of Architectural Technology, Xuzhou; 221116, China^3

[效力级别] 数学

[关键词] Constitutive relations;Finite element simulations;Lead-free solder joint;Maximum stress;Solder joints;Stress strain;Stress-strain response;Uniaxial tensions