Copper-Carbon and Aluminum-Carbon Composites Fabricated by Powder Metallurgy Processes

[摘要] The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers and diamond-reinforced copper and aluminum matrix composites among them are considered very promising as a next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon fibers and copper/diamond and aluminum/carbon fibers composite films by powder metallurgy and hot pressing. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermomechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between metal and carbon, enhancing all the desired thermal properties while minimizing the deleterious effect.

[发布机构] Université Bordeaux 1, Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB), CNRS, 33608 Pessac, France^1;Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, United States^2

[效力级别] 无线电电子学

[关键词] Aluminum matrix composites;High thermal conductivity;Interfacial treatments;Powder metallurgy process;Power electronic devices;Thermal expansion coefficients;Thermal management material;Thermomechanical properties