已收录 268921 条政策
 政策提纲
  • 暂无提纲
Chemical Etching of {hk0} Silicon Plates in EDP Part I: Experiments and Comparison with TMAH
[摘要] This paper deals with the anisotropic chemical etching of various silicon plates etched inEDP. Changes with orientation in geometrical features of etched surface and in theetching shape of starting circular sections are systematically investigated. These etchingshapes are compared with shapes produced by etching in KOH and TMAH solutions;This experimental study allows us to determine the dissolution slowness surface for theEDP solution and to investigate the real influence of the etchant on two dimensional andthree dimensional etching shapes.
[发布日期]  [发布机构] 
[效力级别]  [学科分类] 电子、光学、磁材料
[关键词]  [时效性] 
   浏览次数:2      统一登录查看全文      激活码登录查看全文