Evaluation of Meshed ReferencePlanes for High PerformanceApplications

[摘要] The actual generations of integrated circuits are characterized, inter alia, by very highfrequencies or very high speeds. The dramatic evolution ofthe semiconductor's technologyestablishes a greater “pressure” to the design and the manufacturing of the passive interconnectionstructure from PCB/MCM electronic modules. In these conditions the referenceplanes (power and ground planes) have a more and more important contribution. Thepaper intents to present the effect of different configuration reference planes on the characteristicsof the high speed/high frequency interconnection lines. The first part deals withmodeling and simulation of usual practical interconnection geometries. A computer modelingof meshed structures was realized and Spice models for a good compatibility withcircuit simulators were obtained.S-,Y-,Z- parameters and radiation patterns were calculated,too. The second part contains measurements made by a vector network analyzeras regards to different practical configurations manufactured at Technical University ofBudapest.

[学科分类] 电子、光学、磁材料