An Analytical Model for Predicting the Stress Distributions within Single-Lap Adhesively Bonded Beams

[摘要] An analytical model for predicting the stress distributions within single-lap adhesively bonded beams under tension is presented in this paper. By combining the governing equations of each adherend with the joint kinematics, the overall system of governing equations can be obtained. Both the adherends and the adhesive are assumed to be under plane strain condition. With suitable boundary conditions, the stress distribution of the adhesive in the longitudinal direction is determined.

[学科分类] 材料工程