A Parametric Study of Solute Redistribution DuringTransient Liquid Phase Diffusion Bonding Process

[摘要] A parametric study is performed to investigate the soluteredistribution during the transient liquid phase (TLP) diffusionbonding process. The macroscopic solute diffusion inthe liquid and the solid phase, as well as the solid transformationto the liquid due to solute macrosegregation, are consideredin this study. The effects of the following parametersare considered: ratio of solute diffusivity in liquid and solidstate alloy(ξ=Dl/Ds), holding temperatures(θ), a combined parameter related to solidus and liquidus slopes in thephase diagram(ϕ), and the re-melting and re-solidification time(τ). The thickness of the pure liquid zone and the mushy zone of the TLP diffusion bonding process are demonstrated with respect to the above-mentioned parameters. It is shown numerically that the holding time, the holding temperature,and solute diffusivity ratio influence the solute distribution strongly, which in turn influences the liquid zone and mushy zone thickness significantly. It is concluded that for the TLPdiffusion bonding process, the optimal technique parameters are high holding temperature, long holding time, and a large liquidus and solidus temperature slope ratio(ml/ms)of the interlayer material.

[学科分类] 力学，机械学