Influence of Evaporation-Deposition Geometry on Conductive Thin Films

[摘要] There is a striking dependence of the evaporation deposition geometry (i.e. angular distribution of the incidentvapor beam) on the properties of deposited conductive films. This paper discusses solderability, adhesion andlong-term stability of adhesion of Ti-Pd-Au, Ti-Au and Ti-Cu films. In all cases the above properties were improvedby an evaporation deposition geometry with steep angles of the incident vapor beam.

[学科分类] 工程和技术（综合）