Application of Conductive Adhesives in Microcircuits for “Long-Life” Equipment
[摘要] The results of a study of the application of conductive adhesives for attaching semiconductor chips to thin film Auconductors is presented.The study concentrates on measuring the stability of the electrical conductivity of adhesive bonds forsemiconductor chips.Four types of conductive bonding agents and two types of semiconductor back metallization were tested atraised temperatures for up to 10,000 hours.
[发布日期] [发布机构]
[效力级别] [学科分类] 工程和技术(综合)
[关键词] [时效性]