Permanent Interconnection Technology

[摘要] This paper is concerned with the permanent connection of electronic components into sub-systems and is based onthe report of an ERC Working Party that investigated the subject during 1978 and 1979. After an initial descriptionof the interconnection concepts and the relationship the field has to electronic assembly systems in general, a surveyis given of the marketing data that is available that defines the economic importance of the field. This surveyincludes new data obtained by the Working Party. Figures are given for the rest of Europe in general and the UK inparticular and it is noted that the Output at Sales Value in the UK of intereconnection technology products is almostthe same as the Output at Sales Value of ICs in the UK. Within permanent interconnection technology two-thirds ofthe Output at Sales Value is associated with PWBs and one-third with thick/thin film circuits.Research Work in the field is discussed and a division between immediate time scale problems and those involvinga longer time scale is suggested. Twenty-nine immediate time scale R & D problems have been recognized coveringall three interconnection technologies; longer time scale problems will be associated with the continuing decrease inthe size of add-on electronic components.It is concluded that large, fast computer systems will require a decrease in the size and spacing of interconnectionsto match those of the semiconductor chip. This means simultaneous design of semiconductor andassociated interconnection structures tasks well-suited to vertically integrated companies. In contrast, many realtime subassemblies will benefit from greater chip complexity and need fewer outgoing leads per chip, i.e. at widerspacings – needs that can be met by the development of existing techniques. Finally it is suggested that futuredistribution of added value in electronic assembly operations is likely to give all sectors of interconnection businessa steady upward sales trend, with both hybrid and semiconductor manufacturers seeking specialized subsystemsmarkets to replace their present “all things to all customers” policies.

[学科分类] 工程和技术（综合）