An Installed Tape Automated Bonding Unit

[摘要] The Tape Automated Bonding (TAB) was developed and industrialized to achieve a higher packaging density incomputer applications. After elaboration and testing of the prototype units, significant work was done to transferall the activity into production.After a brief review of the principle of TAB technology the main characteristics of the manufacturing site arepresented and the most significant equipments developed for production needs are briefly described. It becomesapparent that TAB and micropackaging technology are not limited to computers but can be considered in manyother microelectronic applications.

[学科分类] 工程和技术（综合）