Ultrasonic Ball/Wedge Bonding of Aluminium Wires

[摘要] The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for theformation of balls on 25 and 75μm diameter aluminium wires is discussed. Ultrasonic welding trials were carriedout and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25μm diameter Al-1% Si wire and Al thin films, Pd-Au thick films and Au flashed Kovar.

[学科分类] 工程和技术（综合）