An Alternative Way of Making Bumps for Tape Automated Bonding

[摘要] Complete testing and high speed automated assembling are the main advantages which are offered by the technologycalled Tape Automated Bonding (TAB). The main step in this technology is a bumping of wafers which is usuallyperformed by the IC manufacturers. When the bumped wafers are not available, the hybrid circuit manufacturersare forced to bump wafers themselves. As the bumping process consists of several operations requiring manypreliminary steps, a new bumping process which is based on ultrasonic bonding of the preformed gold bumps to thealuminium pads of chips has been suggested. Compatibility of such bumped chips with TAB and the shear strengthof those bumps were tested.

[学科分类] 工程和技术（综合）