Improved Hybrid Circuit Assembly Yields and Reliability byGlassivation of the Semiconductor Chip

[摘要] Lead glass passivation (glassivation) of semiconductor chips has been investigated. Glassivation of BC107 typetransistor chips has resulted in improved robustness and their ability to withstand ionic contamination better thancontrol chips. Increased yields were observed when glassivated transistor chips were assembled in ceramic flatpackages.

[学科分类] 工程和技术（综合）