Adhesion Measurements of Metallizations for Hybrid Microcircuits

[摘要] In a method developed for measuring the adhesion of metallic films for hybrid microelectronic circuits, pull rodssoldered or epoxy bonded to metallization pads are pulled off at an angle normal to the substrate. The test circuitsand testing devices are described. Tensile strengths of 40 to 80 N/mm2and 5 to 30 N/mm2are typical for thin-filmcircuits and thick-film circuits, respectively. The weakest point in the overall circuit configuration is determined.The information obtained indicates the maximum permissible mechanical loads to which the discrete devices ofmicroelectronic circuits can be exposed and may also be evaluated for process optimization.

[学科分类] 工程和技术（综合）