Hybrid Interconnection of I.C.'S by Means of Patterns on Flexible Tape

[摘要] Mounting of I.C.'s on thickfilm circuits by means of patterns on foil of a total thickness of about 30 microns isdescribed. The extreme flexibility of the foil and some well controlled characteristics of the thickfilm processaid soldering of the chip with a reproducible low heat resistance to the substrate in a cheap and reliable way.

[学科分类] 工程和技术（综合）