Remarks on Wire and Die Bonding for Hybrid Circuits

[摘要] Advances in hybrid automatic wire bonding include refined joy stick techniques, automatic alignment, a digitallyoperated head for higher speeds and flexibility, missing ball detection and programming aids. Advanced hybrid dieattach equipment will have to accept a large variety of chip presentation techniques but will use CCTV and automaticalignment with microprocessor controls to aid programming and speed output.

[学科分类] 工程和技术（综合）