Fine Lines in a Three Dimensional Interconnect

[摘要] The techniques for the generation of fine lines on rigid and flexible printed circuit boards are reviewed, and it is shown how the tracking on the interconnect can be made to match the requirements of chip carriers, TAB chips or beam leaded or wire bonded chips directly mounted.The use of fine line techniques on planar substrates can be adapted to provide a low cost, high density interconnect which offers a truly three dimensional connection capability without the use of a “back wiring panel”. Such a three dimensional interconnect can offer opportunities for improvement in the removal of heat from high dissipation chips, thus offering significantly increased reliability.

[学科分类] 工程和技术（综合）