Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

[摘要] The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered to multilayer thick-film circuits, mounted on metallic heat sinks. The multi-layer structure contains silver bearing conductors and supports trimmable resistors. The information presented concerns mainly the fabrication of the thick-film circuits and the thermal design.

[学科分类] 工程和技术（综合）