Advanced parametrical modelling of 24 GHz radar sensor IC packaging components

[摘要] This paper deals with the development of an advancedparametrical modelling concept for packaging components of a 24 GHz radarsensor IC used in automotive driver assistance systems. For fast andefficient design of packages for system-in-package modules (SiP), asimplified model for the description of parasitic electromagnetic effectswithin the package is desirable, as 3-D field computation becomes inefficientdue to the high density of conductive elements of the various signal pathsin the package. By using lumped element models for the characterization ofthe conductive components, a fast indication of the design's signal-qualitycan be gained, but so far does not offer enough flexibility to cover thewhole range of geometric arrangements of signal paths in a contemporarypackage. This work pursues to meet the challenge of developing a flexibleand fast package modelling concept by defining parametric lumped-element models forall basic signal path components, e.g. bond wires, vias, strip lines, bumpsand balls.

[学科分类] 电子、光学、磁材料