Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

[摘要] This contribution provides an approach for emulating the behaviour of an ASICtemperature monitoring system (TMon) during run-time for a tightly-coupledprocessor array (TCPA) of a heterogeneous invasive multi-tile architecture tobe used for FPGA prototyping. It is based on a thermal RC modeling approach.Also different usage scenarios of TCPA are analyzed and compared.

[学科分类] 电子、光学、磁材料