Three-dimensional stacking IC packaging technology for NAND-flash memory

[摘要] The article presents the technology of three-dimensional multi-chip packaging and testing of NAND memory module implemented at GS Nanotech in collaboration with Petrozavodsk State University. The main technological operations and quality management methods at each stage of memory modules manufacture are described. These memory modules can be used for solid-state drives production.

[发布机构] Petrozavodsk State University, 31 Lenina str., Petrozavodsk; 185910, Russia^1;GS Nanotech, 11 Industrialnaya str., Gusev; 238050, Russia^2

[效力级别] 机械制造 [学科分类] 材料科学（综合）

[关键词] IC packaging;Memory modules;Multi chip packaging;NAND flash memory;Nand memory;Solid state drives;Technological operations;Three dimensional stacking