Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations

[摘要] In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.

[学科分类] 骨科学

[关键词] Soft encapsulation;Flexible electronics;Electrical stimulation