Recent progress in 3D integration technology

[摘要] References(52)Cited-By(4)3D integration technology is the key for future LSIs with high-performance, low-power and multi-functionality. Especially, to mitigate various concerns caused by device scaling down to 10 nm or less, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of materials, devices and technologies are integrated on a Si substrate. Future prospects of such a heterogeneous 3D integration technology has been discussed representing typical examples of heterogeneous 3D LSIs after the present situation of 3D integration technology is described.

[学科分类] 电子、光学、磁材料

[关键词] 3D integration;TSV;heterogeneous integration;3D DRAM;3D image sensor;3D microprocessor