Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)
[摘要]
[发布日期] [发布机构]
[效力级别] [学科分类] 电子、光学、磁材料
[关键词] thermal management;three-dimensional integrated circuit (3D IC);coaxial through-silicon-via (C-TSV);temperature [时效性]
