Relationships between grain structure and stress in thin Volmer-Weber metallic films

[摘要] (cont.) The kinetics of the post-deposition tensile rise receive special attention. The ;;reversible;; compressive stress exhibited by polycrystalline, low melting point fcc metal films is found to be absent in epitaxial cases. The stress magnitude in polycrystalline films is shown to be inversely related to grain size and very weakly dependent on temperature. Densification stresses from abnormal grain growth are found to account for the post-deposition tensile rise. Finally, the compressive stresses observed during the deposition of polycrystalline, high mobility gold films is explained using a simple model of trapping of adatoms as grain boundary interstitials.

[发布机构] Massachusetts Institute of Technology