Three wafer stacking for 3D integration.

[摘要] Vertical wafer stacking will enable a wide variety of new system architectures by enabling the integration of dissimilar technologies in one small form factor package. With this LDRD, we explored the combination of processes and integration techniques required to achieve stacking of three or more layers. The specific topics that we investigated include design and layout of a reticle set for use as a process development vehicle, through silicon via formation, bonding media, wafer thinning, dielectric deposition for via isolation on the wafer backside, and pad formation.

[发布日期] 2011-11-01

[学科分类] 材料科学（综合）

[关键词] BONDING;DEPOSITION;DESIGN;DIELECTRIC MATERIALS;FORM FACTORS;SILICON