PREPARATION AND PROPERTIES OF THERMALLY CONDUCTIVEEPOXY RESIN/BORON NITRIDE COMPOSITES

[摘要] The epoxy resin (EP) EP), d ue to its excellent mechanical and electrical properties has beenwidely used in the electronic packaging . With miniaturization and integration of electroniccomponents, the heat generated will increase significantly and heat dissipation demand ofelectronic packaging materials increases accordingly. However, t hermal conductivity ofordinary epoxy resin is only 0. 19 W/m·K. In view of this, heat will be accumulated duringoperation of components, internal stress increases and a series of problems (e.g. crackingof products) may be caused. For this, improvement on thermal conductivity property ofepoxy resin is one of the main subject s in electronic packaging materials field. In thispaper, the thermally conductive epoxy resin composites with different hexagonal boronnitride ( h BN) content were prepared by using h BN as filler and EP as matrix. In addition,the effects of h BN content on thermal conductivity of EP/ h BN composites wereinvestigated. The results showed that thermal conductivity of EP/ h BN composites waseffectively improved through the addition of h B N. Moreover, the composite obtainedwith 15 wt% h BN particle loading presented a thermal conductivity of 0.6264W/(m·K),223.72% higher than that of pure EP.

[学科分类] 生物技术

[关键词] : Epoxy resin H BN Thermally conductiv ity Composites